Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron . Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
Through-hole packages
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.
Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
Acronym
Full name
Remark
SIP
Single in-line package
DIP
Dual in-line package
0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) or 0.6 in (15.24 mm) apart.
CDIP
Ceramic DIP [1]
CERDIP
Glass-sealed ceramic DIP [1]
QIP
Quadruple in-line package
Like DIP but with staggered (zig-zag) pins.[1]
SKDIP
Skinny DIP
Standard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart.[1]
SDIP
Shrink DIP
Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.[1]
ZIP
Zig-zag in-line package
MDIP
Molded DIP [2]
PDIP
Plastic DIP [1]
Surface mount
Acronym
Full name
Remark
CCGA
Ceramic column-grid array (CGA)[3]
CGA
Column-grid array[3]
CERPACK
Ceramic package[4]
CQGP[5]
LLP
Lead-less lead-frame package
A package with metric pin distribution (0.5–0.8 mm pitch)[6]
LGA
Land grid array[3]
LTCC
Low-temperature co-fired ceramic[7]
MCM
Multi-chip module[8]
MICRO SMDXT
Micro surface-mount device extended technology[9]
Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame .
Chip carrier
A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
Acronym
Full name
Remark
BCC
Bump chip carrier[3]
CLCC
Ceramic lead-less chip carrier[1]
LCC
Lead-less chip carrier[3]
Contacts are recessed vertically.
LCC
Leaded chip carrier[3]
LCCC
Leaded ceramic-chip carrier[3]
DLCC
Dual lead-less chip carrier (ceramic)[3]
PLCC
Plastic leaded chip carrier[1] [3]
Pin grid arrays
Acronym
Full name
Remark
OPGA
Organic pin-grid array
FCPGA
Flip-chip pin-grid array[3]
PAC
Pin array cartridge[10]
PGA
Pin-grid array
Also known as PPGA[1]
CPGA
Ceramic pin-grid array[3]
Flat packages
Acronym
Full name
Remark
-
Flat-pack
Earliest version metal/ceramic packaging with flat leads
CFP
Ceramic flat-pack[3]
CQFP
Ceramic quad flat-pack[1] [3]
Similar to PQFP
BQFP
Bumpered quad flat-pack[3]
DFN
Dual flat-pack
No lead[3]
ETQFP
Exposed thin quad flat-package[11]
PQFN
Power quad flat-pack
No-leads, with exposed die-pad[s] for heatsinking[12]
PQFP
Plastic quad flat-package[1] [3]
LQFP
Low-profile quad flat-package[3]
QFN
Quad flat no-leads package
Also called as micro lead frame (MLF ).[3] [13]
QFP
Quad flat package [1] [3]
MQFP
Metric quad flat-pack
QFP with metric pin distribution[3]
HVQFN
Heat-sink very-thin quad flat-pack, no-leads
SIDEBRAZE[14] [15]
[clarification needed ]
[clarification needed ]
TQFP
Thin quad flat-pack[1] [3]
VQFP
Very-thin quad flat-pack[3]
TQFN
Thin quad flat, no-lead
VQFN
Very-thin quad flat, no-lead
WQFN
Very-very-thin quad flat, no-lead
UQFN
Ultra-thin quad flat-pack, no-lead
ODFN
Optical dual flat, no-lead
IC packaged in transparent packaging used in optical sensor
Small outline packages
Acronym
Full name
Remark
SOP
Small-outline package[1]
CSOP
Ceramic small-outline package
DSOP
Dual small-outline package
HSOP
Thermally-enhanced small-outline package
HSSOP
Thermally-enhanced shrink small-outline package[16]
HTSSOP
Thermally-enhanced thin shrink small-outline package[16]
mini-SOIC
Mini small-outline integrated circuit
MSOP
Mini small-outline package
Maxim uses the trademarked name µMAX for MSOP packages
PSOP
Plastic small-outline package[3]
PSON
Plastic small-outline no-lead package
QSOP
Quarter-size small-outline package
The terminal pitch is 0.635 mm.[3]
SOIC
Small-outline integrated circuit
Also known as SOIC NARROW and SOIC WIDE
SOJ
Small-outline J-leaded package
SON
Small-outline no-lead package
SSOP
Shrink small-outline package[3]
TSOP
Thin small-outline package[3]
TSSOP
Thin shrink small-outline package[3]
TVSOP
Thin very-small-outline package[3]
VSOP
Very-small-outline package[16]
VSSOP
Very-thin shrink small-outline package[16]
Also referred as MSOP = micro small-outline package
WSON
Very-very-thin small-outline no-lead package
USON
Very-very-thin small-outline no-lead package
Slightly smaller than WSON
Chip-scale packages
Example WL-CSP devices sitting on the face of a
U.S. penny . A
SOT-23 device is shown (top) for comparison.
Acronym
Full name
Remark
BL
Beam lead technology
Bare silicon chip, an early chip-scale package
CSP
Chip-scale package
Package size is no more than 1.2× the size of the silicon chip[17] [18]
TCSP
True chip-size package
Package is same size as silicon[19]
TDSP
True die-size package
Same as TCSP[19]
WCSP or WL-CSP or WLCSP
Wafer-level chip-scale package
A WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package.[20]
PMCP
Power mount CSP (chip-scale package)
Variation of WLCSP, for power devices like MOSFETs. Made by Panasonic.[21]
Fan-out WLCSP
Fan-out wafer-level packaging
Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it.
eWLB
Embedded wafer level ball grid array
Variation of WLCSP.
MICRO SMD
-
Chip-size package (CSP) developed by National Semiconductor[22]
COB
Chip on board
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy.[23] Also used for LEDs . In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package.
COF
Chip-on-flex
Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.
TAB
Tape-automated bonding
Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires . Used by LCD driver ICs.
COG
Chip-on-glass
Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.
Ball grid array
Ball grid array (BGA) uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.[1] [3]
Acronym
Full name
Remark
FBGA
Fine-pitch ball-grid array
A square or rectangular array of solder balls on one surface[3]
LBGA
Low-profile ball-grid array
Also known as laminate ball-grid array [3]
TEPBGA
Thermally-enhanced plastic ball-grid array
CBGA
Ceramic ball-grid array[3]
OBGA
Organic ball-grid array[3]
TFBGA
Thin fine-pitch ball-grid array[3]
PBGA
Plastic ball-grid array[3]
MAP-BGA
Mold array process - ball-grid array [1]
UCSP
Micro (μ) chip-scale package
Similar to a BGA (A Maxim trademark example )[18]
μBGA
Micro ball-grid array
Ball spacing less than 1 mm
LFBGA
Low-profile fine-pitch ball-grid array[3]
TBGA
Thin ball-grid array[3]
SBGA
Super ball-grid array[3]
Above 500 balls
UFBGA
Ultra-fine ball-grid array[3]
Transistor, diode, small-pin-count IC packages
MELF : Metal electrode leadless face (usually for resistors and diodes)
SOD: Small-outline diode.
SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323).
TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
TO-3 : Panel-mount with leads
TO-5 : Metal can package with radial leads
TO-18 : Metal can package with radial leads
TO-39
TO-46
TO-66 : Similar shape to the TO-3 but smaller
TO-92 : Plastic-encapsulated package with three leads
TO-99 : Metal can package with eight radial leads
TO-100
TO-126 : Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
TO-220 : Through-hole plastic package with a (usually) metal heat sink tab and three leads
TO-226[24]
TO-247 :[25] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
TO-251 :[25] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
TO-252 :[25] (also called SOT428, DPAK):[25] SMT package similar to the DPAK but smaller
TO-262 :[25] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
TO-263 :[25] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
TO-274 :[25] Also called Super-247: SMT package similar to the TO-247 without the mounting hole
Dimension reference
Surface-mount
C
Clearance between IC body and PCB
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch
Through-hole
C
Clearance between IC body and board
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch
WB
IC body width
WL
Lead-to-lead width
Package dimensions
All measurements below are given in mm . To convert mm to mils , divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).
C
Clearance between package body and PCB .
H
Height of package from pin tip to top of package.
T
Thickness of pin.
L
Length of package body only.
LW
Pin width.
LL
Pin length from package to pin tip.
P
Pin pitch (distance between conductors to the PCB).
WB
Width of the package body only.
WL
Length from pin tip to pin tip on the opposite side.
Dual row
Image
Family
Pin
Name
Package
L
WB
WL
H
C
P
LL
T
LW
DIP
Y
Dual inline package
8-DIP
9.2–9.8
6.2–6.48
7.62
7.7
2.54 (0.1 in)
3.05–3.6
1.14–1.73
32-DIP
15.24
2.54 (0.1 in)
LFCSP
N
Lead-frame chip-scale package
0.5
MSOP
Y
Mini small-outline package
8-MSOP
3
3
4.9
1.1
0.10
0.65
0.95
0.18
0.17–0.27
10-MSOP
3
3
4.9
1.1
0.10
0.5
0.95
0.18
0.17–0.27
16-MSOP
4.04
3
4.9
1.1
0.10
0.5
0.95
0.18
0.17–0.27
SOSOIC SOP
Y
Small-outline integrated circuit
8-SOIC
4.8–5.0
3.9
5.8–6.2
1.72
0.10–0.25
1.27
1.05
0.19–0.25
0.39–0.46
14-SOIC
8.55–8.75
3.9
5.8–6.2
1.72
0.10–0.25
1.27
1.05
0.19–0.25
0.39–0.46
16-SOIC
9.9–10
3.9
5.8–6.2
1.72
0.10–0.25
1.27
1.05
0.19–0.25
0.39–0.46
16-SOIC
10.1–10.5
7.5
10.00–10.65
2.65
0.10–0.30
1.27
1.4
0.23–0.32
0.38–0.40
SOT
Y
Small-outline transistor
SOT-23-6
2.9
1.6
2.8
1.45
0.95
0.6
0.22–0.38
SSOP
Y
Shrink small-outline package
0.65
TDFN
N
Thin dual flat no-lead
8-TDFN
3
3
3
0.7–0.8
0.65
—
0.19–0.3
TSOP
Y
Thin small-outline package
0.5
TSSOP
Y
Thin shrink small-outline package
8-TSSOP[26]
2.9-3.1
4.3-4.5
6.4
1.2
0.15
0.65
0.09–0.2
0.19–0.3
Y
14-TSSOP[27]
4.9-5.1
4.3-4.5
6.4
1.1
0.05-0.15
0.65
0.09-0.2
0.19-0.30
20-TSSOP[28]
6.4-6.6
4.3-4.5
6.4
1.1
.05-0.15
0.65
0.09-0.2
0.19-0.30
µSOP
Y
Micro small-outline package[29]
µSOP-8
3
4.9
1.1
0.65
US8 [30]
Y
US8 package
2
2.3
3.1
.7
0.5
Quad rows
Image
Family
Pin
Name
Package
WB
WL
H
C
L
P
LL
T
LW
PLCC
N
Plastic leaded chip-carrier
1.27
CLCC
N
Ceramic leadless chip-carrier
48-CLCC
14.22
14.22
2.21
14.22
1.016
—
0.508
LQFP
Y
Low-profile quad flat package
0.50
TQFP
Y
Thin quad flat-package
TQFP-44
10.00
12.00
0.35–0.50
0.80
1.00
0.09–0.20
0.30–0.45
TQFN
N
Thin quad flat no-lead
LGA
Package
x
y
z
52-ULGA
12 mm
17 mm
0.65 mm
52-ULGA
14 mm
18 mm
0.10 mm
52-VELGA
?
?
?
Multi-chip packages
A variety of techniques for interconnecting several chips within a single package have been proposed and researched:
By terminal count
Example of component sizes, metric and imperial codes and comparison included
Composite image of a 11×44 LED matrix lapel
name tag display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
SMD capacitors (on the left) with two through-hole capacitors (on the right)
Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC ).
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in),[32] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in) package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.[33]
Two-terminal packages
Rectangular passive components
Mostly resistors and capacitors .
Package
Approximate dimensions, length × width
Typical resistor power rating (W)
Metric
Imperial
0201
008004
0.25 mm × 0.125 mm
0.010 in × 0.005 in
03015
009005
0.3 mm × 0.15 mm
0.012 in × 0.006 in
0.02[34]
0402
01005
0.4 mm × 0.2 mm
0.016 in × 0.008 in
0.031[35]
0603
0201
0.6 mm × 0.3 mm
0.02 in × 0.01 in
0.05[35]
1005
0402
1.0 mm × 0.5 mm
0.04 in × 0.02 in
0.062[36] –0.1[35]
1608
0603
1.6 mm × 0.8 mm
0.06 in × 0.03 in
0.1[35]
2012
0805
2.0 mm × 1.25 mm
0.08 in × 0.05 in
0.125[35]
2520
1008
2.5 mm × 2.0 mm
0.10 in × 0.08 in
3216
1206
3.2 mm × 1.6 mm
0.125 in × 0.06 in
0.25[35]
3225
1210
3.2 mm × 2.5 mm
0.125 in × 0.10 in
0.5[35]
4516
1806
4.5 mm × 1.6 mm
0.18 in × 0.06 in[37]
4532
1812
4.5 mm × 3.2 mm
0.18 in × 0.125 in
0.75[35]
4564
1825
4.5 mm × 6.4 mm
0.18 in × 0.25 in
0.75[35]
5025
2010
5.0 mm × 2.5 mm
0.20 in × 0.10 in
0.75[35]
6332
2512
6.3 mm × 3.2 mm
0.25 in × 0.125 in
1[35]
6863
2725
6.9 mm × 6.3 mm
0.27 in × 0.25 in
3
7451
2920
7.4 mm × 5.1 mm
0.29 in × 0.20 in[38]
Tantalum capacitors
Package
Dimensions (Length, typ. × width, typ. × height, max.)
EIA 2012-12 (KEMET R, AVX R)
2.0 mm × 1.3 mm × 1.2 mm
EIA 3216-10 (KEMET I, AVX K)
3.2 mm × 1.6 mm × 1.0 mm
EIA 3216-12 (KEMET S, AVX S)
3.2 mm × 1.6 mm × 1.2 mm
EIA 3216-18 (KEMET A, AVX A)
3.2 mm × 1.6 mm × 1.8 mm
EIA 3528-12 (KEMET T, AVX T)
3.5 mm × 2.8 mm × 1.2 mm
EIA 3528-21 (KEMET B, AVX B)
3.5 mm × 2.8 mm × 2.1 mm
EIA 6032-15 (KEMET U, AVX W)
6.0 mm × 3.2 mm × 1.5 mm
EIA 6032-28 (KEMET C, AVX C)
6.0 mm × 3.2 mm × 2.8 mm
EIA 7260-38 (KEMET E, AVX V)
7.2 mm × 6.0 mm × 3.8 mm
EIA 7343-20 (KEMET V, AVX Y)
7.3 mm × 4.3 mm × 2.0 mm
EIA 7343-31 (KEMET D, AVX D)
7.3 mm × 4.3 mm × 3.1 mm
EIA 7343-43 (KEMET X, AVX E)
7.3 mm × 4.3 mm × 4.3 mm
[39] [40]
Aluminum capacitors
Package
Dimensions (Length, typ. × width, typ. × height, max.)
Cornell-Dubilier A
3.3 mm × 3.3 mm × 5.5 mm
Chemi-Con D
4.3 mm × 4.3 mm × 5.7 mm
Panasonic B
4.3 mm × 4.3 mm × 6.1 mm
Chemi-Con E
5.3 mm × 5.3 mm × 5.7 mm
Panasonic C
5.3 mm × 5.3 mm × 6.1 mm
Chemi-Con F
6.6 mm × 6.6 mm × 5.7 mm
Panasonic D
6.6 mm × 6.6 mm × 6.1 mm
Panasonic E/F, Chemi-Con H
8.3 mm × 8.3 mm × 6.5 mm
Panasonic G, Chemi-Con J
10.3 mm × 10.3 mm × 10.5 mm
Chemi-Con K
13 mm × 13 mm × 14 mm
Panasonic H
13.5 mm × 13.5 mm × 14 mm
Panasonic J, Chemi-Con L
17 mm × 17 mm × 17 mm
Panasonic K, Chemi-Con M
19 mm × 19 mm × 17 mm
[41] [42] [43]
Small-outline diode (SOD)
Package
Dimensions (Length, typ. × width, typ. × height, max.)
SOD-80C
3.5 mm × ⌀ 1.5 mm[44]
SOD-123
2.65 mm × 1.6 mm × 1.35 mm[45]
SOD-128
3.8 mm × 2.5 mm × 1.1 mm[46]
SOD-323 (SC-90)
1.7 mm × 1.25 mm × 1.1 mm[47]
SOD-523 (SC-79)
1.2 mm × 0.8 mm × 0.65 mm[48]
SOD-723
1.4 mm × 0.6 mm × 0.65 mm[49]
SOD-923
0.8 mm × 0.6 mm × 0.4 mm[50]
Metal electrode leadless face (MELF)
Mostly resistors and diodes ; barrel shaped components, dimensions do not match those of rectangular references for identical codes.[51]
Package
Dimensions
Typical resistor rating
Power (W)
Voltage (V)
MicroMELF (MMU), 0102
2.2 mm × ⌀ 1.1 mm
0.2–0.3
150
MiniMELF (MMA), 0204
3.6 mm × ⌀ 1.4 mm
0.25–0.4
200
MELF (MMB), 0207
5.8 mm × ⌀ 2.2 mm
0.4–1.0
300
DO-214
Commonly used for rectifier, Schottky, and other diodes.
Package
Dimensions (incl. leads) (Length, typ. × width, typ. × height, max.)
DO-214AA (SMB)
5.4 mm × 3.6 mm × 2.65 mm[52]
DO-214AB (SMC)
7.95 mm × 5.9 mm × 2.25 mm[52]
DO-214AC (SMA)
5.2 mm × 2.6 mm × 2.15 mm[52]
Three- and four-terminal packages
Small-outline transistor (SOT)
Package
Aliases
Dimensions (excl. leads) (Length, typ. × width, typ. × height, max.)
Number of terminals
Remark
SOT-23-3
TO-236-3, SC-59
2.92 mm × 1.3 mm × 1.12 mm[53]
3
SOT-89
TO-243,[54] SC-62[55]
4.5 mm × 2.5 mm × 1.5 mm[56]
4
Center pin is connected to a large heat-transfer pad
SOT-143
TO-253
2.9 mm × 1.3 mm × 1.22 mm[57]
4
Tapered body, one larger pad denotes terminal 1
SOT-223
TO-261
6.5 mm × 3.5 mm × 1.8 mm[58]
4
One terminal is a large heat-transfer pad
SOT-323
SC-70
2 mm × 1.25 mm × 1.1 mm[59]
3
SOT-416
SC-75
1.6 mm × 0.8 mm × 0.9 mm[60]
3
SOT-663
1.6 mm × 1.2 mm × 0.6 mm[61]
3
SOT-723
1.2 mm × 0.8 mm × 0.55[62]
3
Has flat leads
SOT-883
SC-101
1 mm × 0.6 mm × 0.5 mm[63]
3
Is lead-less
Other
DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three[64] or five-terminal[65] versions.
D2PAK (TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions.[66]
D3PAK (TO-268): Even larger than D2PAK.[67] [68]
Five- and six-terminal packages
Small-outline transistor (SOT)
Package
Aliases
Dimensions (excl. leads) (Length, typ. × width, typ. × height, max.)
Number of terminals
Leaded or leadless
SOT-23-6
SOT-26, SC-74
2.9 mm × 1.3 mm × 1.3 mm[69]
6
Leaded
SOT-353
SC-88A
2 mm × 1.25 mm × 0.95 mm[70]
5
Leaded
SOT-363
SC-88, SC-70-6
2 mm × 1.25 mm × 0.95 mm[71]
6
Leaded
SOT-563
1.6 mm × 1.2 mm × 0.6 mm[72]
6
Leaded
SOT-665
1.6 mm × 1.6 mm × 0.55 mm[73]
5
Leaded
SOT-666
1.6 mm × 1.2 mm × 0.6 mm[74]
6
Leaded
SOT-886
1.45 mm × 1 mm × 0.5 mm[75]
6
Leadless
SOT-891
1 mm × 1 mm × 0.5 mm[76]
5
Leadless
SOT-953
1 mm × 0.8 mm × 0.5 mm[77]
5
Leaded
SOT-963
1 mm × 1 mm × 0.5 mm[78]
6
Leaded
SOT-1115
1 mm × 0.9 mm × 0.35 mm[79]
6
Leadless
SOT-1202
1 mm × 1 mm × 0.35 mm[80]
6
Leadless
Various SMD chips, desoldered
MLP package 28-pin chip, upside down to show contacts
Packages with more than six terminals
Dual-in-line
Quad-in-line
Quad-in-line :
Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm
Quad flat package (QFP ): various sizes, with pins on all four sides
Low-profile quad flat-package (LQFP ): 1.4 mm high, varying sized and pins on all four sides
Plastic quad flat-pack (PQFP ), a square with pins on all four sides, 44 or more pins
Ceramic quad flat-pack (CQFP ): similar to PQFP
Metric quad flat-pack (MQFP ): a QFP package with metric pin distribution
Thin quad flat-pack (TQFP ), a thinner version of LQFP
Quad flat no-lead (QFN ): smaller footprint than leaded equivalent
Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
Micro leadframe package (MLP , MLF ): with a 0.5 mm contact pitch, no leads (same as QFN)
Power quad flat no-lead (PQFN ): with exposed die-pads for heatsinking
Grid arrays
Ball grid array (BGA): A square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm (0.050 in)
Fine-pitch ball grid array (FBGA ): A square or rectangular array of solder balls on one surface
Low-profile fine-pitch ball grid array (LFBGA ): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
Micro ball grid array (μBGA ): Ball spacing less than 1 mm
Thin fine-pitch ball grid array (TFBGA ): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder.
Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch).
Non-packaged devices
Although surface-mount, these devices require specific process for assembly.
Chip-on-board (COB) , a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy ) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top" .
Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a flex circuit . Tape-automated bonding process is also a chip-on-flex process as well.
Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass.
Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles.
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.
See also
References
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External links
Single diode
DO-201 (DO-27)
DO-204 (DO-7 / DO-26 / DO-35 / DO-41)
DO-213 (MELF / SOD-80 / LL34)
DO-214 (SMA / SMB / SMC)
SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin Single row Dual row Quad row Grid array Wafer Related topics It is relatively common to find packages that contain other components than their designated ones, such as diodes or
voltage regulators in transistor packages, etc.